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COMSOL Multiphysics® 6.2 Release Highlights

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ECAD Import Module Updates

New Elevation Option for IPC-2581 and ODB++ File Import

For users of the ECAD Import Module, COMSOL Multiphysics® version 6.2 expands the import functionality for the IPC-2581 and ODB++ PCB formats with a new Metal layer between dielectric layers elevation option. When importing and creating a PCB geometry using this option, the interior copper layers are positioned such that their thickness contributes to the overall board thickness. In previous versions, this was possible by manually specifying the layer elevations.

The COMSOL Multiphysics UI showing the Model Builder with the Import node highlighted, the corresponding Settings window, and two Graphics windows.
The 3D geometry of a planar transformer imported from an IPC-2581 file using the new Metal layer between dielectric layers option for calculating layer elevations.

Support for implementation of the ODB++ format was provided by Mentor Graphics Corporation pursuant to the ODB++ Solutions Development Partnership General Terms and Conditions.