Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Integrated Solar Thermal Collector with Heat Storage

A.R. Sánchez-Guitard[1], E. Ruiz-Reina[1]
[1]University of Málaga, Málaga, Spain

In this work, we study the design of a new integrated system for Solar Water Heating that combines the solar thermal energy collection (primary circuit) with the heat storage (secondary circuit) into the same device. We have performed different finite element method simulations using COMSOL Multiphysics®, for solving the equations of heat transfer (conduction and convection) and those of fluid ...

Two Step Study of Flow in an Industrial Pulp Screen, Solved with the COMSOL Multiphysics® Mixer Module - new

R. Wetind[1]
[1]Wetind Technology AB, Alnö, Sweden

An industrial pulp screen is investigated. The dilute pulp is pumped through a screen barrier. In order to avoid the fiber network to plug, it is necessary to 1) fluidize the shear thinning pulp 2) expose the barrier with plug releasing pressure pulses. This work involves a 2-step study. Step 1: The full screen flow is simulated using Mixer Module Frozen Rotor k-. Essential pressure field ...

Modelling of the Dynamical Fluorescent Micro-Thermal Imaging Experiment on the Heat Diffusion in the La5Ca9Cu24O41 Spin Ladder Compound - new

E. Khadikova[1], F. de Haan[1], P. H. M. van Loosdrecht[2]
[1]Zernike Institute for Advanced Materials, University of Groningen, Groningen, The Netherlands
[2]Department of Physics, University of Cologne, Köln, Germany

The dynamical fluorescent micro-thermal imaging (FMI) experiment has been used to investigate the phonon-magnon interaction in the 1D Heisenberg antiferromagnet La5Ca9Cu24O41. This material shows highly anisotropic heat conductivity due to the efficient magnetic heat transport along the spin ladders in the compound carried by magnetic excitations (magnons). To extract information on the phonon ...

Micromachined Silicon Integrating Cavities for Far-Infrared Bolometer Arrays - new

M. Audley[1], G. de Lange[1], G. Keizer[1], C. Bracken[2]
[1]SRON Netherlands Institute for Space Research, Groningen, The Netherlands
[2]National University of Ireland, Maynooth, Co. Kildare, Ireland

We are investigating gold-plated micromachined silicon integrating cavities for arrays of far infrared Transition Edge Sensor bolometers. We present the results of our simulations and show how we used COMSOL Multiphysics® software to optimize the geometry of the integrating cavity. We show that we can achieve a high optical efficiency over a wide frequency range.

Modeling and Simulation of High Sensitivity CMOS Pressure Sensor Using Free Boundary Circular Diaphragm Embedded on Ring Channel Shaped MOSFET

S. Joy[1], T. Tom[1]
[1]Rajagiri School of Engineering and Technology, Kochi, Kerala, India

Sensors have diverse applications ranging from medical field to space explorations. They convert physical parameters such as temperature, pressure, humidity etc: - into an electrical output. The discovery of piezoresistivity property of silicon and germanium led to miniaturization of pressure sensors. Improvement in the sensitivity is the major factor to be considered while designing pressure ...

Uncertainty Quantification: What it is and Why it is Important for Multiphysics Simulations

P. Qian [1, 2],
[1] University of Wisconsin - Madison, Madison, WI, USA
[2] SmartUQ, Madison, WI, USA

Uncertainty appears in many aspects of physical simulations including stochastic design parameters, hard-to-specify input distributions, probabilistic boundary and initial conditions, and unknown geometries. Uncertainty Quantification (UQ) has emerged as the science of quantitative characterization and reduction of uncertainties in both simulation and test results. Stretching across applied ...

Modelagem Computacional de Difusores para Microbombas

A. G. S. Barreto Neto [1], A. M. N. Lima [2], C. S. Moreira [1],
[1] Instituto Federal de Ciência e Tecnologia - IFPB, João Pessoa, PB, Brasil
[2] Universidade Federal de Campina Grande - UFCG, Campina Grande, PB, Brasil

Este trabalho trata do dimensionamento da estrutura bocal/difusor utilizando a simulação computacional com fronteira móvel. Esse tipo de simulação contempla toda estrutura da bomba, isto é, câmara de bombeamento, difusor e área de dispersão de fluxo, de modo a contabilizar o refluxo em função da estrutura, possibilitando um projeto mais realísticos da estrutura.

Study on the Thermal Behaviors of LFP Aluminum-laminated Battery with Different Tab Configurations

M. Jia [1], S. Du [1],
[1] School of Metallurgy and Environment, Central South University, Changsha 410083, PR China

Abstract: A 3.2V/10Ah LFP aluminum-laminated batteries are chosen as the target of the present study. A three-dimensional thermal simulation model is established based on finite element theory and proceeding from the internal heat generation of the battery[13]. The study illustrates a three-dimensional relationship among the total internal heat generation rate of the battery, the discharge rate ...

Measuring the Spectra of Metamaterials at an Oblique Incidence

X. Ni[1,2], Z. Liu[1,2], and A.V. Kildishev[1,2]
[1]School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana, USA
[2]Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana, USA

The emergence of electromagnetic metamaterials has given rise to a variety of fascinating applications, including the perfect lens and the optical cloaking device. For a long time the study of the properties of metamaterials was limited to normal incidence only. However, it is extremely important to know the behavior of metamaterials especially in the area of imaging. In this paper, we use ...

COMSOL Derived Universal Scaling Model For Low Reynolds Number Viscous Flow Through Microfabricated Pillars – Applications to Heat Pipe Technology

N. Srivastava[1], and C.D. Meinhart[1]
[1]Department of Mechanical Engineering, University of California Santa Barbara, Santa Barbara California, USA

Cooling of high-power density electronic devices remains a challenge. Microfluidic heat-pipes with the potential of achieving ultra-high thermal conductivities offer a low-cost technology for cooling electronics. To achieve high thermal conductivity, it is critical to maximize the rate of liquid transport inside the heat pipe. We propose a novel array of microfabricated pillars to maximize ...

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