Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Computer Simulation Of Haematopoietic Stem Cells Migration Using COMSOL Multiphysics

G. Bencheva
Institute for information and communication technologies, Bulgarian Academy of Sciences, Sofia, Bulgaria

Various haematological diseases, including leukaemia, are characterized by abnormal production of particular blood cells. Two important properties of haematopoietic stem cells (HSCs) are used in their therapy, namely: a) rapid migratory activity and ability to \'\'home\'\' to their niche in the bone marrow; b) high self-renewal and differentiation capacity, responsible for the production and ...

Numerical modelling of the damage potential of climate variations to a historic wooden cabinet

Z. Huijbregts, H. Schellen, and J. van Schijndel
Department of the Built Environment
Eindhoven University of Technology
Eindhoven, The Netherlands

The two wooden cabinets of Jan van Mekeren that are located in Amerongen Castle show comparable wood damage; in particular large cracks in the cabinet doors are clearly noticeable. It is assumed that these cracks were caused by bad indoor climate conditions in the castle. Combined computational modelling of the indoor climate conditions in the castle and the hygroscopic and mechanical ...

Advanced Application of an Automated Generative Tool for MEMS Based on COMSOL Multiphysics

F. Bolognini
University of Cambridge
Cambridge, UK

This work presents a different use of COMSOL as an integrated component of a computational tool framework used to automate designs creation. CNS-Burst is a computational synthesis method that has been implemented with the aim of automatically generating solutions to an assigned design task. COMSOL is integrated in the method and used to evaluate the performance of the design solutions found. ...

Finite Element Analysis of Equine Tooth Movement Under Masticatory Loading

M. Gardemin[1], M. Lüpke[1], V. Cordes[2], and C. Staszyk[2]
[1]Institute for General Radiology and Medical Physics, University of Veterinary Medicine Hannover, Hannover, Germany
[2]Institute of Anatomy, University of Veterinary Medicine Hannover, Hannover, Germany

Like humans, horses can develop a variety of dental problems. Different equine diseases occur in different areas of the equine cheek tooth or its surrounding tissues. With a realistic simulation of a chewing cycle it can be possible to link mechanical phenomena such as high stress in distinct areas to commonly occurring diseases. According to different angles of the acting chewing force, ...

Combined Analytical and Numerical Modeling of a Resonant MEMS Sensor for Viscosity and Mass Density Measurements

S. Cerimovic[1], R. Beigelbeck[2], H. Antlinger[3], J. Schalko[2], B. Jakoby[3], and F. Keplinger[1]
[1]Institute of Sensor and Actuator Systems, Vienna University of Technology, Vienna, Austria
[2]Institute for Integrated Sensor Systems, Austrian Academy of Sciences, Wiener Neustadt, Austria
[3]Institute for Microelectronics and Microsensors, Johannes Kepler University Linz, Linz, Austria

A resonant MEMS sensor for viscosity and mass density measurements of liquids was modeled. The device is based on Lorentz-force excitation and features an integrated piezoresistive readout. The core sensing element is a rectangular vibrating plate suspended by four beam springs. The liquid surrounding the plate influences the resonant behavior of the system. Thus, evaluating the properties of ...

An Improved Model for High Temperature Inductive Heating

S. A. Halvorsen, and N. Kleinknecht
Teknova AS
Kristiansand, Norway

An axially symmetric multiphysics model for industrial induction furnaces has successfully been converted from COMSOL Multiphysics version 3.5a to version 4.2. The model combines computation of magnetic fields, heat transfer and thermal stresses. The inner part of the furnace is described by a few discrete state variables. While the current in the induction coil is input in COMSOL, the model ...

Impulsive Thermomechanics of hypersonic surface phononic crystals

F. Banfi[1], D. Nardi[2], and M. Travagliati[3]
[1]Dipartimento Matematica e Fisica, Università Cattolica, Brescia, Italy
[2]JILA, University of Colorado at Boulder, Boulder, Colorado, United States
[3]Center for Nanotechnology Innovation @NEST, Istituto Italiano di Tecnologia, Pisa, Italy

Ultrafast optical generation of pseudosurface acoustic waves is investigated in hypersonic surface phononic crystals. The thermomechanics is modeled from first-principles to follow the initial impulsive heat-driven displacement in the time domain. Spectral decomposition of the displacement over the surface phononic crystal eigenmodes outlines asymmetric resonances featuring the coupling between ...

Numerical Study of the Effect of Fins on the Natural Convection Driven Melting of Phase Change Material

C. Liu, and D. Groulx
Mechanical Engineering
Dalhousie University
Halifax, NS
Canada

Natural convection has to be accounted and simulated for in order to properly describe the physics encounter in the phase change process. A simplified two-dimensional model was created in COMSOL 4.1. Natural convection was accounted for by adding a volume force and using the Boussinesq approach. The heat transfer and laminar flow physics were used. Results showed that natural convection played ...

Finite Element Analysis of Integrated Circuit Interconnect Lines on Lossy Silicon Substrate

S. Musa[1], M. Sadiku[1], and A. Emam[2]

[1]Roy G. Perry College of Engineering, Prairie View A&M University, Prairie View, TX
[2]Information Systems Department, King Saud University, Riyadh, Saudi Arabia

The silicon substrate has a significant effect on the inductance parameter of a lossy interconnect line on an integrated circuit. It is essential to take this into account in determining the transmission line electrical parameters. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using the finite element ...

Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors

R. Martin, J. Kozak, K. Anglin, and W. Goodhue
University of Massachusetts Lowell
Lowell, MA

Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4.0 was used to test various geometric configurations of the fixture. 2D and 3D models were created in order ...

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