Now Live: COMSOL Conference 2013 Boston Abstracts
Phil Kinnane | September 9, 2013
Now is the time to start planning your visit to Boston for the COMSOL Conference 2013. If you would like to plan ahead in terms of which presentations to attend, you’ll be happy to hear that the abstracts for the Boston location are now being posted to the COMSOL Conference website. These will soon be followed by the abstracts for the Bangalore and Rotterdam user presentations as well.
Browse Abstracts for the COMSOL Conference 2013 Boston
To learn more about the user presentations at this year’s conference, check out the abstracts that have been published so far. The abstracts have been categorized according to their technical topic area for easy browsing. Looking through these, it appears as though Computational Fluid Dynamics (CFD), Bioscience and Bioengineering, and Multiphysics are the most popular topics thus far. Personally, I work a bit with modeling in the chemical engineering and electrochemistry disciplines, and there are a number of interesting presentations on this topic that I will be sitting in on.
Thermal Contact Gas Gap Conductance, Carbon Dioxide Separation, and More
As in previous years, researchers from Oak Ridge National Lab (ORNL) will be attending and presenting their simulation work. The group, headed by Jim Freels, has been to every conference and presented applications involving fluid dynamics, structural mechanics, and nuclear reactor kinetics. This year, they have a few presentations, one of which concerns heat transfer using the new thermal contact feature in COMSOL. Another interesting abstract comes from the Marshall Space Flight Center, in Huntsville, AL, USA. During the user presentation, the authors will be describing the latest results from their work on separating carbon dioxide and water vapor from air in spacecraft.
These are just a couple of abstracts that caught my eye, but there are plenty more uploaded to the website. Browse all COMSOL Conference 2013 Boston abstracts to see which topics appeal to you most.