Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Simulation of Current Density for Electroplating on Silicon Using a Hull Cell

F. Lima[1], U. Mescheder[1], H. Reinecke[3]
[1]Hochschule Furtwangen University, Furtwangen, Baden-Wuerttemberg, Germany
[3]Institut für Mikrosystemtechnik, Freiburg im Breisgau, Baden-Wuerttemberg, Germany

Electrodeposition has a major advantage over other methods of thin film deposition. It allows deposition at atmospheric pressure and room temperature, requiring inexpensive equipment. However, there are several parameters which can influence an electroplated metal layer quality. The current density distribution is taken into consideration. The Hull cell is an electrodeposition tank with a ...

Analysis of Heat, Mass Transport, and Momentum Transport Effects in Complex Catalyst Shapes for Gas-Phase Heterogeneous Reactions Using COMSOL Multiphysics

A. Nagaraj[1], and P. Mills[2]

[1]Department of Electrical Engineering and Computer Science, Texas A&M University, Kingsville, TX, USA
[2]Department of Chemical and Natural Gas Engineering, Texas A&M University, Kingsville, TX, USA

The global demand for sulfuric acid has been forecast to grow at an average of 2.6% per year from 2005 – 2010. The primary objective of this work is to analyze the performance of various heterogeneous catalyst shapes that have been proposed for the oxidation of SO2 to SO3 used in the manufacture of sulfuric acid. COMSOL Multiphysics provides a powerful numerical platform for simulation of ...

High Curvature Bending of Ultra-Thin Chips and Chip-on-Foil Assemblies

D. van den Ende[1]
[1]Holst Centre / TNO, Eindhoven, The Netherlands

Ultra-thin chips of less than 20µm become flexible, allowing integration of silicon IC technology with highly flexible electronics. This combination allows for highly intelligent products of unprecedented thinness, flexibility and cost. Examples include sensor systems integrated into food packaging or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile ...

Tunable MEMS Capacitor for RF Applications

H. S. Shriram[1], T. Nimje[1], D. Vakharia[1]
[1]BITS Pilani, Rajasthan, India

Radio Frequency MEMS devices have emerged to overcome the problem of high losses associated with semiconductors at high frequencies. A tunable MEMS capacitor is a micrometre-scale electronic device whose capacitance is controlled through different actuation mechanisms which govern the moving parts. It can have electrostatic or electrothermal actuators depending on the functional complexity and ...

Electrical Conductivity Modeling and Validation in Unidirectional Carbon Fiber Reinforced Polymer Composites

P. Banerjee[1], J. L. Schmidt[1]
[1]Department of Mechanical Engineering and Materials Science, Washington University in St. Louis, St. Louis, MO, USA

Carbon fiber (CF) reinforced polymer composites (CFRP) have begun to replace Al-Zn-Mg alloys in applications which require high strength-to-weight ratios. The anisotropy of CFRP composites is a result of melt crystallized extrusion techniques that impart an inherent directionality to the CFs and the associated material’s properties. Electrical conductivity was modeled across the entire CF ...

Simulation of PTFE Billet Sintering using COMSOL

A. Roday, and P. Nicosia
Garlock Sealing Technologies
Palmyra, NY

Sintering is an important step in the manufacturing of polytetrafluoroethylene (PTFE) billets. The challenge in heating large billets stems from the inherent low thermal conductivity of PTFE. Existing literature suggests determining maximum heating rate experimentally using recommended guidelines. This paper uses COMSOL to aid in optimizing the temperature profile required for a particular ...

Study of Capacitance in Electrostatic Comb-Drive Actuators

P. Hanasi [1], B. G. Sheeparamatti [1], V. Abbigeri [1], N. Meti [1],
[1] Visvesvaraya Technological University, Belagavi, Karnataka, India

Capacitor is mainly defined as two conducting plates that can hold the opposite charges on it. These plates can be used either as a sensor or an actuator. If the relative distance between the two conductors changes as result of given input, then capacitance values will change. This results in basic of capacitive or electrostatic sensing configuration. On the other hand, if a voltage or the ...

Heat Transfer Modeling and Analysis of a Rotary Regenerative Air Pre-heater

R. K. Krishna, R. Ramachandran, and P. Srinivasan
Birla Institute of Technology and Science
Pilani
Rajasthan, India

An attempt has been made to sustain the efficiency of an air pre-heater(APH) in the long run. The APH is modeled using COMSOL Multiphysics in 3D and fed with real life conditions. Upon Heat transfer analysis, the temperature profile was found out and from that, the regions undergoing maximum thermal fatigue stress was identified. The plates of the APH to the periphery are subjected to maximum ...

Study of Stent Deformation and Stress Developed at Different Stent Deployment Pressures

K. Basu[1], P. Ghosh[2], A. Chanda[1]
[1]School of Bio Science and Engineering, Jadavpur University, Kolkata, West Bengal, India
[2]Jadavpur University, Kolkata, West Bengal, India

According to clinical reports, cardiovascular disease has become a major global healthcare problem. The deposition of fats, cholesterol etc. at the arterials walls causes thrombus formation leading to stenosis and arterial blockage. To tackle this, along with arterial bypass, the use of Cardiovascular Stent is considered promising and effective (in single vessel and bi vessel diseases). While ...

Air Damping of Oscillating MEMS Structures: Modeling and Comparison with Experiment

S. Gorelick[1], M. Leivo[1], U. Kantojärvi[1]
[1]VTT Technical Research Centre of Finland, Espoo, Finland

Excessive air damping can be detrimental to the performance of oscillating MEMS components. Complex systems, such as structures in pre-etched cavities or angular comb-drive scanning mirrors, typically require simulations to reliably evaluate the air damping. The simulated and experimental performance of the following systems was evaluated and compared: two types of out-of-plane cantilevers, in ...