Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Finite Element Model of a Complex Glass Forming Process as a Tool for Control Optimization

F. Sawo[1] and T. Bernard[1]
[1]Fraunhofer Institute for Information and Data Processing IITB, Karlsruhe, Germany

This paper addresses the modeling of a complex glass forming process as an example of a complex, nonlinear distributed parameter system. The system is modeled by a fluid dynamics approach, which means that the forming is regarded as a fluid with free surfaces. Here, the coupling of the forming process with the heat flow is considered. The influence of crucial model parameters (e.g., dynamic ...

Multiphase, Dual Polymer Injection Molding and Cooling of an Open Cavity to Form both Distinct and Graduated Material Properties within a Complex Three-Dimensional Body

M.S. Yeoman[1]
[1]Continuum Blue Ltd, Forest Row, United Kingdom

With the advancement of medical devices and implants, many now require more advanced nonlinear, hyper-elastic materials such as elastomers to be extensively utilized in the body. This combined with the need to allow for considerably different, varying and graduated material responses within the three-dimensional device, poses a difficult challenge to manufacturing an elastomeric implant in a ...

Modelling Thermal Time-of-Flight Sensor for Flow Velocity Measurement

O. Ecin[1], E. Engelien[2], M. Malek[2], R. Viga[2], B. Hosticka[1], and A. Grabmaier[2]

[1]Institut of Mikroelektronische Systeme, University Duisburg-Essen, Duisburg, Germany
[2]Institut of Elektronische Bauelemente und Schaltungen, University Duisburg-Essen, Duisburg, Germany

This communication reports on a numeric fluid dynamics simulation on a pipe flow model. The basic background is to determine the velocity of a flowing fluid in a pipe by using the Thermal Time-Of-Flight (TTOF) method on water. The visualization of the temperature and velocity distribution in the pipe model is being carried out in order to enable proper design and optimization of the TTOF sensor. ...

Modeling of Viscous Fingering

E. Holzbecher[1]

[1]Georg-August University, Göttingen, Germany

Viscous fingering is a topic of interest since the beginning of computational fluid dynamics. Here we focus on the classical constellation of miscible displacement, as it has been investigated in Hele-Shaw cells. A temperature or salinity front is entering with a fluid that has a different viscosity. The pure 1D flow is destabilized by the Saffman-Taylor instability. Using COMSOL Multiphysics® ...

Study of Artificial Molecular Engines Action Through COMSOL Multiphysics® Program

L. Moro[1], F. Lugli[1], and F. Zerbetto[1]

[1]Department of Chemistry “G. Ciamician”, Università di Bologna, Bologna, Italy

Rotaxanes are a class of molecules recently developed in laboratory that have been heralded as possible molecular motors. The motor is constituted by a linear molecule (thread) and a ring-shaped molecule (macrocycle), which is free to move along the thread, switching between two, or more, energetically stable interaction points (stations). Molecular motors start their functioning far from ...

Finite Element Analysis of Thermal Fatigue in Thermal Barrier Coatings

U. Bardi[1], C. Borri[1], A. Fossati[1], A. Lavacchi[1], and I. Perissi[1]
[1]Dipartimento di Chimica, Università degli Studi di Firenze, Sesto Fiorentino, FI, Italy

A Finite element model of plasma sprayed TBC’s was developed to estimate the stress induced by thermal cycling experiments. A heat transfer analysis was performed to evaluate the temperature distribution on the specimen during the cooling under an impinging air jet; temperature measurements performed with an infrared pyrometer on the cooled samples show good agreement with the evaluated ...

Thermal Design of Power Electronic Devices and Modules

N. Delmonte[1], M. Bernardoni[1], P. Cova[1], and R. Menozzi[1]
[1]Dipartimento di Ingegneria dell’Informazione, University of Parma, Parma, Italy

This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of Degrees Of Freedom (DOF) due to complex geometry of a power module.

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

Large Scale Outdoor Flammable & Toxic Gas Dispersion Modelling in Industrial Environments

A. Hallgarth[1], A. Zayer[1], A. Gatward[2], and J. Davies[2]

[1]Hazard Research & Risk Consultants Ltd, Aberystwyth, Wales, United Kingdom
[2]Independent Consultants, United Kingdom

HazRes has developed a gas discharge and dispersion model in COMSOL which takes into account the effects of localized wind profiles and turbulence generated by buildings, structures and terrain on the dispersion of gases in question. The main focus of this work is to develop and provide clients with more accurate prediction methods relative to industrial standard software tools in modeling ...

Calculating Power Loss of Contactless Power Transmission Systems with Ferrite Components

S. Hanf[1] and D. Kürschner[1]
[1]Institut für Automation und Kommunikation Magdeburg, Magdeburg, Germany

In this paper a methodology for calculating loss within contactless inductive power transmission systems, resulting from hysteresis and eddy current effects, is presented. The usage of the mathematical models of Stoll and Steinmetz for the determination of core loss with COMSOL is explained. Apart from the metrological verification of selected aspects of power loss, the results of a parametrical ...

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