The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. To download the MPH-files, log in or create a COMSOL Access account that is associated with a valid COMSOL license. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
Fluid-Structure Interaction
This model demonstrates how to set up a fluid-structure interaction problem in COMSOL Multiphysics. It illustrates how fluid flow can deform solid structures and how to solve for the flow in a continuously deforming geometry. The Fluid-Structure Interaction (FSI) multiphysics interface combines fluid flow with solid mechanics to capture the interaction between the fluid and the solid structure. ...
Composite Piezoelectric Transducer
This example shows how to set up a piezoelectric transducer problem following the work of Y. Kagawa and T. Yamabuchi. The composite piezoelectric ultrasonic transducer has a cylindrical geometry that consists of a piezoceramic layer, two aluminum layers, and two adhesive layers. The system applies an AC potential on the electrode surfaces of both sides of the piezoceramic layer. The goal is ...
Capacitive Pressure Sensor
A capacitive pressure sensor is simulated. This model shows how to simulate the response of the pressure sensor to an applied pressure, and also how to analyze the effects of packing induced stresses on the sensor performance.
Surface Acoustic Wave Gas Sensor
A surface acoustic wave (SAW) is an acoustic wave propagating along the surface of a solid material. Its amplitude decays rapidly, often exponentially, through the depth of the material. SAWs are utilized in many kinds of electronic components, including filters, oscillators, and sensors. SAW devices typically apply electrodes to a piezoelectric material to convert an electric signal into a ...
Piezoresistive Pressure Sensor, Shell
Piezoresistive pressure sensors were some of the first MEMS devices to be commercialized. Compared to capacitive pressure sensors, they are simpler to integrate with electronics, their response is more linear and they are inherently shielded from RF noise. They do, however, usually require more power during operation and the fundamental noise limits of the sensor are higher than their capacitive ...
Micropump Mechanism
Micropumps are key components of microfluidic systems with applications ranging from biological fluid handling to microelectronic cooling. This model simulates the mechanism of a valveless micropump, that is designed to be effective at low Reynolds numbers, overcoming hydrodynamic reversibility. Valveless pumps are often preferred in microfludic systems because they minimize the risk of ...
Electrostatically Actuated Cantilever
The elastic cantilever beam is one of the elementary structures used in MEMS designs. This model shows the bending of a cantilever beam under an applied electrostatic load. The model solves the deformation of the beam under an applied voltage.
Piezoelectric Shear-Actuated Beam
The model performs a static analysis on a piezoelectric actuator based on the movement of a cantilever beam, using the Piezoelectric Devices predefined multiphysics interface. Inspired by work done by V. Piefort and A. Benjeddou, it models a sandwich beam using the shear mode of the piezoelectric material to deflect the tip.
External Material Examples, Structural Mechanics
A new way to specify user-defined material models is included in COMSOL Multiphysics version 5.2. For structural mechanics, you have the possibility to either completely define the material model in a domain, or to add an inelastic strain contribution to an elastic material. The external material functions are coded in C, and compiled into a shared library. By programming a wrapper function in ...
Thermal Initial Stresses in a Layered Plate
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced due to the difference in coefficients of thermal expansion. A third layer, the carrier layer, is then introduced in a stress-free ...