The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.

Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. To download the MPH-files, log in or create a COMSOL Access account that is associated with a valid COMSOL license. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.


Natural convection in a closed cavity with mass conservation

Only fully compressible flow can guarantee the mass conservation in time in a closed cavity where the temperature increases. This is a simple proof of concept using the "gravity" option available in V5.2A.

Heat Conduction in a Finite Slab

This simple example covers the heating of a finite slab and how the temperature varies with time. We will set up the problem in COMSOL Multiphysics after which we compare the solution to the analytical solution.

Buoyancy Flow in Water

This example studies the stationary state of free convection in a cavity filled with water and bounded by two vertical plates. To generate the buoyancy flow, the plates are heated at different temperatures, bringing the regime close to the transition between laminar and turbulent. To prepare the model, an estimation of the flow regime is performed using the Reynolds, Grashof, Rayleigh and ...

Out-of-Plane Heat Transfer for a Thin Plate

This example models heat transfer in a thin rectangular metal plate. Because the plate’s thickness is only 1/100 of its length and width, you can simulate the process using a 2D approximation. The plate has a fixed temperature at one end and is isolated at the other. A surrounding liquid cools the plate by convection. In addition, the model considers surface-to-ambient radiation.

Simulation of RF Tissue Ablation

This example exemplifies how to model tissue ablation through applying RF radiation. A more detailed description of the phenomenon, and the modeling process, can be seen in the blog post "[Study Radiofrequency Tissue Ablation Using Simulation](https://www.comsol.com/blogs/study-radiofrequency-tissue-ablation-using-simulation/)".

Condensation Risk in a Wood-Frame Wall

This 2D stationary model computes heat and moisture transport in a wall composed of different hygroscopic materials. A comparison with the Glaser method is given for the temperature and relative humidity solutions. The effect of the use of a vapor barrier is also investigated.

Isothermal MEMS Heat Exchanger

The example concerns a stainless-steel MEMS heat exchanger, which you can find in lab-on-a-chip devices in biotechnology and in microreactors such as for micro fuel cells. This model examines the heat exchanger in 3D, and it involves heat transfer through both convection and conduction. The model solves for the temperature and heat flux in the device and investigate the convective term’s ...

Temperature Field in a Cooling Flange

A cooling flange in a chemical process is used to cool the process fluid, which flows through the flange. The surrounding air cools the flange via natural convection. In the stationary model, the forced convection to the process fluid is modeled using a constant heat transfer coefficient. The natural convection cooling is modeled using tabulated empirical transfer coefficients that are ...

Plate Heat Exchanger

The model has its emphasis on heat transport in a very small heat exchanger that is commonly used in the field of microelectromechanical systems (MEMS). In this case, it might be a reactive processes that needs heating. The heat exchanger itself is constructed by stacking several pleated sheets or plates on top of each other while leaving a gap in between. The fluid used to transfer heat ...

Rapid Thermal Annealing

In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon as the wafer reaches this temperature, it is held there for a few seconds and then finally quenched. An ...