The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.

Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. To download the MPH-files, log in or create a COMSOL Access account that is associated with a valid COMSOL license. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.


Cooling and Solidification of Metal

This example is a model of a continuous casting process. Liquid metal is poured into a mold of uniform cross section. The outside of the mold is cooled and the metal solidifies as it flows through. When the metal leaves the mold, it is completely solidified on the outside, but still liquid inside. The metal will continue to cool and eventually solidify completely, at which point it can be cut ...

Contact Switch

This model illustrates how to implement a multiphysics contact. It models the thermal and electrical behavior of two contacting parts of a switch. The electrical current and the heat flow from one part to the other only through the contact surface. The contact switch device has a cylindrical body and plate hook shapes at the contact area. There, the thermal and electrical apparent resistances ...

Microwave Heating of a Cancer Tumor

Electromagnetic heating is ideally suited for modeling in COMSOL Multiphysics. This model shows the area of hyperthermic oncology but the modeling issues and techniques are generally applicable to any problem involving electromagnetic heating. The purpose of this model is to compute the radiation field and the Specific Absorption Rate (SAR) in liver tissue for a thin coaxial slot antenna used ...

Electronic Chip Cooling

This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using *Convective Heat Flux* boundary conditions. In the second part, the model is extended to include a fluid domain ...

Forced Convection Cooling of an Enclosure with Fan and Grille

This study simulates the thermal behavior of a computer Power Supply Unit (PSU). Most of such electronic enclosures include cooling devices to avoid electronic components to be damaged by excessively high temperatures. In this model, an extracting fan and a perforated grille cause an air flow in the enclosure to cool internal heating.

The Magnus Effect

The Magnus effect explains the curl that soccer players can give the ball, resulting in the enjoyable goals that we can see in every FIFA World Cup™. This model looks at the Magnus effect in the laminar and turbulent flow regimes for transient and stationary flows. It also discusses the simulation results and relates them to experimental measurements on soccer balls found in the literature. ...

Evaporation in Porous Media with Small Evaporation Rate

Evaporation in porous media is an important process in food and paper industry among others. Many physical effects must be considered: fluid flow, heat transfer in porous media and transport of moisture. This tutorial describes how dry air flowing through a humid porous medium can partially dry it. It is assumed that the initial amount of liquid water in the porous medium is large enough and ...

Steady-State 2D Axisymmetric Heat Transfer with Conduction

This model how to build and solve a conductive heat transfer problem using the Heat Transfer interface. The model, taken from a NAFEMS benchmark collection, shows an axisymmetric steady-state thermal analysis. As opposed to the NAFEMS benchmark model, we use the temperature unit kelvin instead of degrees Celsius for this model.

Convection Cooling of Circuit Boards - 3D Forced Convection

The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan cooling). In this case, contributions caused by the induced (forced) flow of air dominate the cooling. To ...

Continuous Casting

This example models the casting process of a metal rod from liquid to solid state using the Non-Isothermal Flow multiphysics interface, which combines heat transfer and fluid flow. The model describes the fluid and solid flow and heat transport, including the phase transfer from melt to solid. This phase change causes momentum changes, latent heat release and a variation in physical ...