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Electrodeposition Module

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	Copper Deposition in a Trench This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary,...
	Decorative Plating Tutorial model of electroplating. The model uses secondary current distribution with full Butler-Volmer kinetics for both anode and cathode. The thickness of the deposited layer at the cathode is computed as well as the pattern caused by...
	Electrode Growth Next to an Insulator This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between...
	Secondary Current Distribution in a Zinc Electrowinning Cell This is a model of the secondary current distribution in a zinc electrowinning cell. The model investigates the impact on the current distribution when changing the electrode alignment in a parametric study. The geometry is in 2D.
	Electrodeposition of a Microconnector Bump This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for...