Viscoplastic Creep in Solder Joints
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations.The model geometry includes two electronic components (chips) mounted on a circuit board by means of several solder ball joints. The circuit board consists of two layers: a thin layer of copper and a thicker layer of FR4 material, while the chips are made of silicon. Intensive plastic flow clearly appears after about 40 s of the loading.
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Engineering Fields
- Thermal Expansion
- Nonlinear Analysis
- Multiphysics
- Semiconductor Applications
Application Areas
- Structural Mechanics
- Semiconductor Devices