Showing result: 1 - 7 of 7
Semiconductor Devices
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RF-Heated Hot Wall Furnace for Semiconductor Processing
Furnace reactors are used in the fabrication of semiconductor industry to grow layers on the wafers. These can also be used for epitaxial growth, which is a key technology for fabrication of electrical devices. For the wide band gap silicon carbide substance growth takes place in graphite susceptor...
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Chemical Vapor Deposition of GaAs
Chemical vapor deposition (CVD) allows a thin film to be grown on a substrate through molecules and molecular fragments adsorbing and reacting on a surface.
This example illustrates the modeling of such a CVD reactor where triethyl-gallium first decomposes, and the reaction products along with a...
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MOS Transistor Model
The MOSFET (Metal Oxide Semiconductor Field-Effect Transistor) is by far the most common semiconductor device, and the primary building block in all commercial processors, memories, and digital integrated circuits. During the past decades this device has experienced tremendous development, and today...
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Semiconductor Diode
A semiconductor diode consists of two regions with different doping: a p-type region with a dominant concentration of holes, and an n-type region with a dominant concentration of electrons.
The model presented here formulates the problem using three dependent variables: psi (electric potential),...
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Distributed SPICE Model of Bipolar Transistor
Integrated semiconductor devices are used in almost all electrical equipment, and the bipolar junction transistor (BJT) is still a very important device although the MOS technology has taken over a large part of the market. Especially in technologies with new types of semiconductors the bipolar tran...
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Optimization of SPICE Parameter Extraction for a Semiconductor Diode
In the design of a semiconductor device, it is often required to develop a compact model for use when analyzing its behavior in larger systems. SPICE models are compact descriptions of electronic circuits, where a set of SPICE parameters determines the device’s behavior in static, transient, and t...
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Viscoplastic Creep in Solder Joints
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations.
The model geometry includes two electronic components (chips) mou...
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