TEL Technology Center, Albany, NYSemiconductor wafer manufacturing involves a number of processes, ranging in size from nanometers to meters. This, along with coupling the physics of chemical...
Replisaurus Technologies AB, Kista, SwedenOnly through advanced packaging techniques can we take advantage of state-of-the-art microelectronic devices. The flip-chip method has become a cost-effective...
Chemical vapor deposition (CVD) is an important step in the process of manufacturing microchips. One of the common applications is the deposition of silicon on wafers at low pressure. Low pressure reactors are used to get a high...
In friction stir welding, a rotating tool moves along the weld joint and melts the aluminum through the generation of friction heat. The tool’s rotation stirs the melted aluminum such that the two plates are joined. In this model,...
Chemical vapor deposition (CVD) allows a thin film to be grown on a substrate through molecules and molecular fragments adsorbing and reacting on a surface. This example illustrates the modeling of such a CVD reactor where...
This tutorial model investigates the effects of various parameters on the electron energy distribution function and rate coefficients for an argon discharge.
This model simulates electrical breakdown in an atmospheric pressure gas. Because electrical breakdown is a complicated process, a 1D model is considered. To highlight the physics of the breakdown process, the model uses a simple argon...
This model investigates the electrical characteristics of the GEC reference cell for argon chemistry.
This model of a high density inductively coupled plasma at 1 torr computes the neutral gas temperature and flow field as well as all the other components which make up the plasma. Gas heating occurs due to quenching of excited Argon atoms.
This model investigates 3D effects for an inductively coupled plasma. Asymmetry in the pressure field leads to non-uniform fluxes to the wafer surface.
This model uses an analytic port to send a plane wave into a reactor containing low pressure Argon. The wave is partially absorbed and reflected by the plasma which sustains the plasma.