Address:
COMSOL, Inc.
1 New England Executive Park, Ste 350
Burlington, MA 01803 USA
Phone: +1 781-273-3322
Fax: +1 781-273-6603
Email: info@comsol.com
Editor and Reader Contact:
Vineet Dravid, Program Chair
vineet@comsol.com
Download this press release in Word format
Call for Papers: COMSOL Conference 2007 Boston
BOSTON (March 14, 2007)—COMSOL, Inc., will hold its third annual conference in the USA on October 4-6 at the Boston Marriott Newton. It will highlight work in the field of multiphysics modeling and simulation using COMSOL Multiphysics. Authors of accepted submissions will present their work at the conference and submit a paper for the proceedings, which last year was distributed in CD format to more than 100,000 individuals around the world.
To learn more about the conference visit http://www.comsol.com/conference2007
Interested parties should e-mail their abstracts to conference@comsol.com. The abstract should be a summary of the individual’s or group’s work (200 - 400 words) that briefly describes the problem, solution, results, and conclusions. It should also list the corresponding author’s full contact information along with the names and affiliations of all contributing authors. The deadline for the submission of abstracts is August 17
Conference Themes
- Acoustics
- Bioscience and Bioengineering
- Earth Science
- Education
- Electromagnetics
- Fluid dynamics
- Fluid-Structure Interactions
- Fuel Cells and Electrochemistry
- Fundamental Studies, Optimization & Numerical Methods
- Heat transfer & Thermo-Mechanics
- Materials Science & Nanotechnology
- MEMS and Microfluidics
- Multiphysics
- Optics
- Photonics
- Plasma Physics, EHD and MHD
- Porous Media Flow
- Process & Chemical Engineering
- Quantum Mechanics
- Reaction Engineering and Reactor Design
- Semiconductor Devices
- Structural Mechanics
- Transport Phenomena
About the COMSOL product line
COMSOL Multiphysics is the first software environment to provide scientists, engineers, and researchers with integrated, best-in-class technology for modeling, simulating, and discovering any system with both single or multiple physics phenomena. A broad range of discipline-specific modules extends the COMSOL environment for chemical engineering, earth science, electromagnetics, heat transfer, MEMS, and structural mechanics applications. COMSOL also offers the COMSOL Reaction Engineering Lab®, which allows users to model reacting systems. COMSOL products are available for the Windows, Linux, Solaris, and the Macintosh operating systems. Full details about COMSOL Multiphysics and related products are available at www.comsol.com.
About the COMSOL Group
COMSOL was founded in 1986 in Stockholm, Sweden, and has grown to include offices in the Benelux, Denmark, Finland, France, Germany, Italy, Norway, Switzerland, the United Kingdom, and a US presence with offices in Burlington, MA, Los Angeles, CA, and Palo Alto, CA. Additional information about the company is available at www.comsol.com

